Characteristics:
Silicaid® 103 is a silicone compound with high thermal conductivity, low bleed,
high temperature stability and a good dielectric constant.
Applications:
Heat sink compound for power transistors & electronic field.
Product Properties:
Color. . . . . . . . . . . . . . . . . . White, opaque.
Penetration (worked 60 strokes) . . . : 250 - 320
Service temp. (range °C) . . . . . . . : -60°C to 200°C (for long periods).
Bleed (200°C/30 hours) . . . . . . . : 0.5% max.
Evaporation (200°C/24 hours) . . . . . : 1% max.
Arc resistance . . . . . . . . . . . . . : 100 seconds min.
Thermal conductivity (K factor) . . . : 10 X 10-4 min.
Dielectric constant (at 1 Kc) . . . . . . : 4 max.
Specific gravity . . . . . . . . . . . . . : 2.3 min.
Military Specifications:
Silicaid® 103 is formulated to meet the requirements of MIL-C-47113 & MIS-11137.
Shelf Life:
Silicaid® 103 is light gray in appearance and does not crack or harden by aging.
Silicaid® 103 has a shelf life of minimum 12 months if stored in tightly closed original container.
How to Use:
Silicaid® 103 is generally applied to the base and mounting studs of power transistors and diodes for thermal and heat transfer between them. Silicaid® 103 provide a good insulation as well.
Silicaid® 103 can be applied by brushing or wiping.
Safety Instructions:
Please consult Silicaid® 103 MSDS
Packaging:
Standard: 10kg, 2kg & tube 220gr.
Other sort of packaging can be used in order to meet specific customer requirements.